发明名称 |
Multilayer printed wiring board |
摘要 |
A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.
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申请公布号 |
US8324512(B2) |
申请公布日期 |
2012.12.04 |
申请号 |
US201113004325 |
申请日期 |
2011.01.11 |
申请人 |
TOYODA YUKIHIKO;KAWAMURA YOICHIRO;IKEDA TOMOYUKI;IBIDEN CO., LTD. |
发明人 |
TOYODA YUKIHIKO;KAWAMURA YOICHIRO;IKEDA TOMOYUKI |
分类号 |
H05K1/11;H01L21/48;H01L23/498;H05K1/02;H05K3/28;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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