| 摘要 |
A first via and a second via pass through a layer of a multi-layered circuit board. A first set of electrical transmission line segments, each having a first thickness, is aligned at a first area on the layer between the first and second vias. A second set of electrical transmission line segments, each having a second thickness that is greater than the first thickness, are aligned at a second area that is offset to the first area and to the first and second vias. The first set of electrical transmission line segments is connected to the second set of electrical transmission line segments to form an electrical transmission line, which has an average impedance that matches a line impedance of a uniform thickness line. |
