SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to minimize an electrical link distance of a main antenna and a semiconductor chip by soldering the main antenna and the semiconductor chip together. CONSTITUTION: A main antenna(42) is arranged to be adjacent to a semiconductor chip. A sealing unit(20) solders the semiconductor chip and the main antenna together. An auxiliary antenna(45) is formed at an external side of the sealing unit. The auxiliary antenna forms coupling with the main antenna. The main antenna and the auxiliary antenna transmit and receive high frequencies of a millimeter band using the coupling.