发明名称 Mass production of small temperature sensors with flip chips
摘要 For producing a temperature sensor having a conductive trace structured in 3 tiers, the conductive trace of a sensor tip is structured from a platinum tier, and is connected to a conductive trace segment on both the front and back sides of a 10-30 mm long plastic strip, in one layer leading from one plate to the other between two 20-200 µm spaced plates, thereby extending the sensor tip with a conductive trace segment made of a Pt structure on an inorganic plate with copper conductive traces along the plastic strip. Spaced from the plastic strip, two contact fields made of copper are bridged with the platinum structure. The Pt structure with the Cu conductive traces and therefore the two plates thereon are connected to one another via contact fields, by printing and burning contact fields made of AgPt or AgPtPd paste onto the platinum structure, and a tin solder, which contains Ag, Cu or Pb, is applied to the conductive trace segment made of copper, and the contact fields are soldered with the soft solder to the fired on metal paste. More particularly, a ceramic printed circuit board as a sensor tip is soldered lengthwise onto the plastic strips, and the plastic strips are fixed between two leads of a cable.
申请公布号 DK201270293(A) 申请公布日期 2012.12.02
申请号 DK20120070293 申请日期 2012.05.31
申请人 HERAEUS SENSOR TECHNOLOGY GMBH 发明人 WIENAND, KARLHEINZ;ECKERT, KARLHEINZ;HACKER, GERNOT;JOST, THOMAS
分类号 G01K7/18 主分类号 G01K7/18
代理机构 代理人
主权项
地址