Method and device for creating a wiring pattern on a substrate

摘要

The circuit assembly has a substrate (4) with an electronic component (6). A metallic and electrically conductive strip (2) is arranged in a circuit pattern on the substrate. Connections (19) of the electronic component are electrically connected with contacting areas (8) of the conductive strip. Independent claims are also included for the following: (1) a method for creating a wiring pattern on a substrate; and (2) a device for creating a wiring pattern on a substrate.