| 摘要 |
PRE-PLATED LEADFRAME HAVING ENHANCED 5 ENCAPSULATION ADHESION A PROCESS FOR PRODUCING A PRE-PLATED LEADFRAME THAT HAS ENHANCED ADHESION BY MOLDING COMPOUND IS PROVIDED, WHEREIN A BASE LEADFRAME MATERIAL IS FIRST PLATED WITH MULTIPLE LAYERS OF METALLIC MATERIAL. THEREAFTER, THE PLATED BASE LEADFRAME 10 MATERIAL IS COVERED WITH A MASK, SO AS TO EXPOSE SELECTED SURFACES THEREOF AT UNMASKED AREAS WHERE ENHANCED ADHESION OF MOLDING COMPOUND IS DESIRED. THE SAID UNMASKED AREAS ARE PLATED WITH A LAYER OF COPPER BEFORE REMOVING THE MASK. OPTIONALLY, THE LAYER OF COPPER MAY FURTHER BE OXIDIZED TO FORM A LAYER OF SPECIALLY CONTROLLED COPPER OXIDE. 15 (FIG. 2(F)) |
