摘要 |
In this application, we have the following examples: (1) Integrating the NID functionality in to the small foot-print of an SFP Module, with one or more of the features below: a) Mounting a NID SoC IC to an existing SFP Printed Circuit Board (PCB); b) Using the power from the SFP module, without requiring separate external power; c) NID SoC having only 2 ports, each with its own MAC and possibly PHY layer; d) NID SoC having an embedded microprocessor, RAM and ROM. Many examples and applications are provided. |