| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing which has excellent electro-chemical deburring resistance, soldering resistance, burning resistance, low warpage, continuous moldability, and storage stability, and an electronic part device of which the element is sealed using the cured product of the resin composition for sealing and which has excellent reliability. <P>SOLUTION: The resin composition for sealing has structure represented by the following general formula (1) and includes: an epoxy resin (A) including a polymer with d=0 and a polymer with d≥1; a phenolic resin-based curing agent (B); and an inorganic filler (C). In the electronic part device, the element is sealed using the cured product obtained by curing the resin composition for sealing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
