发明名称 |
HEAT-DISSIPATION DEVICE AND ELECRTONIC DEVICE THEREON |
摘要 |
A heat dissipation device is used for a circuit board, and plural electronic components are mounted on a surface of the circuit board. The heat dissipation device includes a heat dissipation plate that is made of metal. Once the heat dissipation plate shields above a surface of the circuit board, a distance exists between the heat dissipation plate and the surface so as to form an air flow passage to increase the heat dissipation performance. |
申请公布号 |
US2012300408(A1) |
申请公布日期 |
2012.11.29 |
申请号 |
US201213364306 |
申请日期 |
2012.02.01 |
申请人 |
KAO HAN YU;LIAO TSE HSINE;CHEN KUEI MIN;GIGA- BYTE TECHNOLOGY CO., LTD. |
发明人 |
KAO HAN YU;LIAO TSE HSINE;CHEN KUEI MIN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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