| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an MEMS sensor improving a uniformity of a stress acting on a bonding interface of a metal bonding section. <P>SOLUTION: A frame 14 partitioning an operation region 15 and an external region 16 is formed in a functional layer 10. The frame 14 and a supporting substrate 1 are bonded to each other with a first insulating layer 3a therebetween. The frame 14 and a wiring board 2 are bonded to each other with a metal bonding section 30a therebetween. In the metal bonding section 30a, a first metal layer 31a is formed on the surface of the wiring board 2, a second metal layer 32a is formed on the surface of the frame 14, and the first and second metal layers 31a and 32a are bonded to each other by being heated nd pressurized. The outer circumferential side surface 3c of the first insulating layer 3a is retracted farther toward the operation region than the outer circumferential side surface 14a of the frame 14. An outer circumferential end B of a bonding interface A between the first and second metal layers is positioned farther toward the outside in the direction to be away from the operating region than the outer circumferential side surface 3c of the first insulating layer 3a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
