| 摘要 |
<P>PROBLEM TO BE SOLVED: To promote size reduction and speed enhancement of a system-in-package (SIP) type semiconductor device where a system is constructed by mounting a memory chip and a microcomputer chip on a wiring board. <P>SOLUTION: When a microcomputer chip 20 and a memory chip 30 are mounted on a top face of a wiring board 10, the memory chip 30 is arranged so that a second conductive pad 15 of the wiring board 10 arranged along a first chip side 31a (side where a data system electrode pad 33D is arranged) of the memory chip 30 is positioned in an area between an extended line of a third chip side 21c of the microcomputer chip 20 and an extended line of a fourth chip side 21d in a plan view, thereby minimizing a length of a data system wiring 16D that connects a data system electrode pad 23D of the microcomputer chip 20 and the data system electrode pad 33D of the memory chip 30 to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
