| 摘要 |
Technologies are generally described for a component, a method to form a component and/or a system configured to form a component. In an example, the method to form a component may include placing a first layer including a conductive material on a support. The method may include placing a second layer, including the conductive material and oxygen, on the first layer. The method may include placing a third layer, including tellurium and oxygen, on the second layer. The method may include placing a fourth layer, including tin and tellurium, on the third layer. In an example, placing of the fourth layer on the third layer may include placing a fifth layer including tellurium on the fourth layer, placing a sixth layer including tin on the fifth layer, placing an seventh layer including tellurium on the sixth layer and annealing the fifth, sixth, and seventh layers to form the fourth layer.
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