HIGH-FREQUENCY CIRCUIT SUBSTRATE

摘要

Provided is a high-frequency circuit substrate with which transmission delay and loss are sufficiently smaller than conventional high-frequency circuit substrates. In the high-frequency circuit substrate, a metallic conductor for wiring which has not had either roughening processing or primer processing on the surface thereof, is directly adhered with a fluorine resin dielectric layer, and transfer loss in the 1GHz band is -3dB/m or less. Composite relative dielectric constant is 2.6 or less, and composite dielectric loss tangent is 0.0007 or less.