发明名称 METHOD FOR MANUFACTURING CIRCUIT BOARD WITH CIRCUIT WIRING AND SEMICONDUCTOR PACKAGE WITH CIRCUIT WIRING
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit board of which manufacturing process is simple and confirmation of failure during the manufacturing process is possible, being comprised of a circuit wiring that can allow mutual intersection in the same plane. <P>SOLUTION: A circuit board 100 includes a substrate body 10 with a first terminal 15 and a second terminal 18 separated from the first terminal, and a wiring 20 in which conductive polarized particles 22, having a first polarity and a second polarity opposite to the first polarity, are continuously arranged on the substrate body, with a wiring part 22 for electrically connecting the first and second terminals and an insulating part 24 for covering the wiring part. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012235174(A) 申请公布日期 2012.11.29
申请号 JP20120194935 申请日期 2012.09.05
申请人 SK HYNIX INC 发明人 KANG TAE MIN
分类号 H01L23/12;H01L25/065;H01L25/07;H01L25/18;H01R12/50 主分类号 H01L23/12
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