| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition capable of forming a cured product enabling both adhesion to a substrate, metal wiring and the like and luminance in a hydrosilyl polysiloxane composition. <P>SOLUTION: The curable composition includes a polysiloxane (A) having an alkenyl group and an adhesible group, a polysiloxane (B) having at least two silicon atom-bonded hydrogen atoms per one molecule (except the polysiloxane (A)), and a catalyst (C) for hydrosilylation reaction. With the premise that the total sum of the contents of the all components in the curable composition is 100 mass%, the content ratio of the polysiloxane (A) is 40-90 mass%. The curable composition is a hydrosilyl polysiloxane composition capable of forming a cured product enabling both high adhesion to a substrate, metal wiring and the like and high initial luminance such as LEDs. Therefore, the optical semiconductor device obtained by covering a semiconductor light emitting device with a cured product obtained from the curable composition has high initial luminance, and high adhesion of the cured product without the risk of exfoliation of the cured product from a package even in the case of receiving heat cycles. <P>COPYRIGHT: (C)2013,JPO&INPIT |
