发明名称 |
METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE |
摘要 |
A method for manufacturing an acoustic wave device includes: adhering wafer-shaped first and second piezoelectric substrates to a front face of a first and second adhesive sheet respectively and dividing the first and the second piezoelectric substrates into rectangles; adhering a third and fourth adhesive sheet to the first and second piezoelectric substrates respectively and moving at least one divided portions of the first and second piezoelectric substrates selectively to the third and fourth adhesive sheet respectively; moving the first piezoelectric substrate on the first adhesive sheet to the fourth adhesive sheet; and moving the second piezoelectric substrate on the second adhesive sheet to the third adhesive sheet.
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申请公布号 |
US2012297595(A1) |
申请公布日期 |
2012.11.29 |
申请号 |
US201213480253 |
申请日期 |
2012.05.24 |
申请人 |
INOUE KAZUNORI;MIYASHITA TSUTOMU;MATSUMOTO KAZUHIRO;TAIYO YUDEN CO., LTD. |
发明人 |
INOUE KAZUNORI;MIYASHITA TSUTOMU;MATSUMOTO KAZUHIRO |
分类号 |
H01L41/00 |
主分类号 |
H01L41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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