发明名称 |
METHOD OF BONDING A METAL TO A SUBSTRATE |
摘要 |
A method of bonding a metal to a substrate involves forming a plurality of nano-features in a surface of the substrate, where each nano-feature is chosen from a nano-pore and/or a nano-crevice. In a molten state, the metal is over-cast onto the substrate surface, and penetrates the nano-features. Upon cooling, the metal is solidified inside the nano-features, where the solidification of the metal forms a mechanical interlock between the over-cast metal and the substrate. |
申请公布号 |
US2012301669(A1) |
申请公布日期 |
2012.11.29 |
申请号 |
US201113310042 |
申请日期 |
2011.12.02 |
申请人 |
GM GLOBAL TECHNOLOGY OPERATIONS LLC |
发明人 |
WALKER MICHAEL J.;POWELL, JR. BOB R.;LUO AIHUA A. |
分类号 |
B32B3/00;B05D1/36;B05D3/00;B05D3/06;B05D3/10 |
主分类号 |
B32B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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