发明名称 METHOD OF BONDING A METAL TO A SUBSTRATE
摘要 A method of bonding a metal to a substrate involves forming a plurality of nano-features in a surface of the substrate, where each nano-feature is chosen from a nano-pore and/or a nano-crevice. In a molten state, the metal is over-cast onto the substrate surface, and penetrates the nano-features. Upon cooling, the metal is solidified inside the nano-features, where the solidification of the metal forms a mechanical interlock between the over-cast metal and the substrate.
申请公布号 US2012301669(A1) 申请公布日期 2012.11.29
申请号 US201113310042 申请日期 2011.12.02
申请人 GM GLOBAL TECHNOLOGY OPERATIONS LLC 发明人 WALKER MICHAEL J.;POWELL, JR. BOB R.;LUO AIHUA A.
分类号 B32B3/00;B05D1/36;B05D3/00;B05D3/06;B05D3/10 主分类号 B32B3/00
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