发明名称 SEMICONDUCTOR DEVICE HAVING METAL PLUG AND METHOD OF FORMING THE SAME
摘要 Provided is a semiconductor device including first, second and third source/drain regions. A first conductive plug in contact with the first source/drain regions, having a first width and a first height, and including a first material is provided. An interlayer insulating layer covering the first conductive plug and the substrate is disposed. A second conductive plug vertically penetrating the interlayer insulating layer to be in contact with the second source/drain regions, having a second width and a second height, and including a second material is provided. A third conductive plug vertically penetrating the interlayer insulating layer to be in contact with the third source/drain regions, having a third width and a third height, and including a third material is disposed. The second material includes a noble metal, a noble metal oxide or a perovskite-based conductive oxide.
申请公布号 US2012299072(A1) 申请公布日期 2012.11.29
申请号 US201213425906 申请日期 2012.03.21
申请人 KIM WAN-DON;LEE SEUNG-HWAN;KIM BEOM-SEOK;CHO KYU-HO;KWON OH-SEONG;CHOI GEUN-KYU;LIM JI-EUN;TAK YONG-SUK 发明人 KIM WAN-DON;LEE SEUNG-HWAN;KIM BEOM-SEOK;CHO KYU-HO;KWON OH-SEONG;CHOI GEUN-KYU;LIM JI-EUN;TAK YONG-SUK
分类号 H01L27/06 主分类号 H01L27/06
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