Forming metallic conductor pattern on surface of substrate made of semiconductor material, comprises providing discrete textured areas of semiconductor material, and carrying out galvanic deposition of metallic seed layer and metal layer

摘要

Forming metallic conductor pattern on the surface of a substrate made of a semiconductor material, exhibiting a protective layer, comprises providing discrete textured areas of the semiconductor material by selective removal of the protective layer, and carrying out galvanic deposition of a metallic seed layer and subsequently at least one further metal layer. The surface of the substrate is applied with a hydrophobic substance before or after the depositing the starting layer.