发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a printed circuit board and a method of manufacturing the same. The method of manufacturing a printed circuit board includes: preparing a base substrate having first circuit layers formed on one surface or both surfaces thereof; forming a plating resist having openings for a first via layer on the base substrate; forming first via layers in the openings for a first via layer; forming insulating layers having outer metal layers on the base substrate having the first via layers formed thereon; forming openings for a second via layer over the first via layer on the insulating layers and the outer metal layers; and completing multi-layer vias by forming second via layers in the openings.
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申请公布号 |
US2012298412(A1) |
申请公布日期 |
2012.11.29 |
申请号 |
US201113204425 |
申请日期 |
2011.08.05 |
申请人 |
MUN KYUNG DON;CHO MIN JUNG;HWANG SUN UK;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MUN KYUNG DON;CHO MIN JUNG;HWANG SUN UK |
分类号 |
H05K1/11;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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