| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate, a circuit board and the like at low cost, which are excellent in thermal conductivity, machinability, flame retardance, resin flowability, and hygroscopic insulation. <P>SOLUTION: A thermosetting resin composition is used, which is characterized by containing 40-80 parts by volume of an inorganic filler per 100 parts by volume of the total of the thermosetting resin solid content and the inorganic filler and which is characterized in that the inorganic filler contains: (A) gibbsite type aluminum hydroxide particles and/or magnesium hydroxide particles having an average particle diameter (D50) of 1-15 μm; (B) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or less; and (C) a molybdenum compound. This thermosetting resin composition is also characterized in that the blending ratios (by volume) of the component (A), the component (B) and the component (C) are respectively 30-70%, 1-40% and 1-10% when the total volume of the inorganic filler is taken as 100%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
