| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer semiconductor package which reduces a dimension of a multi-chip module in which a die or chip is laminated. <P>SOLUTION: A semiconductor package 100 includes a semiconductor die 120 mounted on an upper side thereof, and a base substrate 130 above which an interposer substrate 110 is disposed being mounted on an upper portion of the die. A bottom side of the interposer substrate is electrically connected to an upper side of the base substrate by vertical connectors 150. An upper side of the interposer substrate which is substantially exposed includes input-output terminals 140 so that additional electronic components are mounted thereon. The base substrate 130 and interposer substrate 110 include the input-output terminals so that the components mounted on these substrates are electrically connected by the vertical connectors 150. This base substrate can also be electrically connected to a printed circuit board. The vertical connectors 150 are disposed along a number of side portions of the package, so that a routing space between the substrates is increased. <P>COPYRIGHT: (C)2013,JPO&INPIT |
