发明名称 |
ELECTRONIC MEMBER, ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic member which can supply joint material at a fine pitch, and can be electrically connected. <P>SOLUTION: To one or more connection terminals provided on a circuit substrate, one or more electrodes provided on an electronic member is electrically joined through a joint layer. The joint layer is configured by mainly sintered silver. The whole area or a part of an electrode surface which is not contacted with the joint layer is a roughening layer of silver oxide. The thickness of the roughening layer of the silver oxide is 400 nm to 5 μm, and the outermost surface of the layer of the silver oxide has a curvature radius smaller than 1 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012235163(A) |
申请公布日期 |
2012.11.29 |
申请号 |
JP20120177687 |
申请日期 |
2012.08.10 |
申请人 |
HITACHI LTD |
发明人 |
IDE HIDEKAZU;MORITA TOSHIAKI;YASUDA YUSUKE |
分类号 |
H05K1/09;H01L21/52;H01L21/56;H01L21/60;H01L23/12;H01L25/065;H01L25/07;H01L25/18;H05K3/46 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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