发明名称 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME
摘要 The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a curing accelerator; (D) a specific silicone resin; and (E) a specific alcohol compound.
申请公布号 US2012299039(A1) 申请公布日期 2012.11.29
申请号 US201213478848 申请日期 2012.05.23
申请人 UCHIDA TAKAHIRO;NORO HIROSHI;NITTO DENKO CORPORATION 发明人 UCHIDA TAKAHIRO;NORO HIROSHI
分类号 H01L33/62;C09D163/00 主分类号 H01L33/62
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