发明名称 THERMAL-RESPONSIVENESS MEASUREMENT METHOD FOR THIN-FILM SHAPED RAW MATERIAL AND THIN-FILM FILM THICKNESS MEASUREMENT DEVICE
摘要 <p>The present invention provides a means for measuring various thermal properties of a thin film comprising a polymer material. A thermal-responsiveness measurement method pertaining to this invention is characterized by including: a step in which a thin-film film thickness measurement device is used and data relating to the film thickness of a thin film to be analyzed is measured at at least two temperatures, for a sensor chip (a sensor chip to be analyzed) having the thin film to be analyzed formed on the surface thereof; and a step (a film thickness calculation step) in which changes in film thickness relative to the temperature of the thin film to be analyzed are calculated. The use of the thin-film film thickness measurement device comprising a program temperature adjustment means for measuring thermal responsiveness, for the thin film to be analyzed formed on the surface of the sensor chip, is desirable in order to provide this kind of thermal-responsiveness measurement method.</p>
申请公布号 WO2012161287(A1) 申请公布日期 2012.11.29
申请号 WO2012JP63396 申请日期 2012.05.24
申请人 KONICA MINOLTA ADVANCED LAYERS, INC.;NINOMIYA, HIDETAKA;MURAYAMA, TAKANORI;KASHIWAZAKI, OSAMU;MURAMATSU, SHINICHI;SEKIYA, TADANOBU 发明人 NINOMIYA, HIDETAKA;MURAYAMA, TAKANORI;KASHIWAZAKI, OSAMU;MURAMATSU, SHINICHI;SEKIYA, TADANOBU
分类号 G01N25/16;G01B11/06;G01N21/21;G01N21/27 主分类号 G01N25/16
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