| 摘要 |
10AbstractSusceptor for supporting a semiconductor wafer and method for depositing a layer on a front side of a semiconductor waferA susceptor for supporting a semiconductor wafer during the deposition of a layer on a front side of the semiconductor wafer, wherein the semiconductor wafer has a diameter D and, at its edge, a notch having a depth T, comprisinga ring-shaped placement area having an internal diameter d for the placement of the semiconductor wafer in the edge region of a rear side of the semiconductor wafer, wherein, with the semiconductor wafer having been placed, the following holds true: (D - d)/2 < T; anda protrusion - extending the placement area inward - of the placement area for the placement of the semiconductor wafer in the region of the notch of the semiconductor wafer, which completely underlays the notch of the placed semiconductor wafer.Fig. 3
|
