发明名称 LED MODULE AND LIGHTING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a lighting system capable of securing heat radiation and strength at low cost and enabling downsizing. <P>SOLUTION: The lighting system is provided with an LED substrate 3 mounting an LED 2, a circuit board 6 forming a driving circuit of the LED 2, a support member 21 which supports the LED substrate 3 and the circuit board 6 and is formed of a heat radiation resin of insulation body, and metallic heat transfer members 22, 23 which are in contact with the LED substrate 3 and are embedded in the support member 21. The lighting system has an outer surface formed capable of holding by an outer circumference of the support member 21. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012234628(A) 申请公布日期 2012.11.29
申请号 JP20110100328 申请日期 2011.04.28
申请人 SHARP CORP 发明人 SHOJI HIROYUKI
分类号 F21S2/00;F21Y101/02 主分类号 F21S2/00
代理机构 代理人
主权项
地址