发明名称 RESIN COMPOSITION FOR FORMING CONDUCTIVE INK ABSORBING LAYER, CONDUCTIVE INK ABSORBING BASE MATERIAL AND SUBSTRATE FOR FORMING CIRCUIT AS WELL AS PRINTED MATTER, CONDUCTIVE PATTERN AND CIRCUIT SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition for forming a conductive ink absorbing layer capable of forming an ink absorbing layer which is excellent in adhesiveness between conductive ink and the ink absorbing layer, and adhesiveness between the ink absorbing layer and various kinds of supporting bodies, and capable of forming the ink absorbing layer equipped with a thin line property without causing the conductive ink to run. <P>SOLUTION: The resin composition for forming the conductive ink absorbing layer includes: a vinyl polymer (A) which is obtained by polymerizing a vinyl monomer mixture containing 30-70 mass% of methyl methacrylate (a1) and a total of 0.2-5.0 mass% of one or more kinds selected from a group comprising a carboxyl group-containing vinyl monomer (a2) and an amide group-containing vinyl monomer (a3), and has a glass-transition temperature of 10-70&deg;C; and an aqueous vehicle (B). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012232434(A) 申请公布日期 2012.11.29
申请号 JP20110101126 申请日期 2011.04.28
申请人 DIC CORP 发明人 SAITO KIMIE;FUJIKAWA WATARU;SHIRAGA JUN
分类号 B41M5/00;B41M5/50;B41M5/52;C08F220/06;C08F220/12;C08F220/56;H05K3/10;H05K3/38 主分类号 B41M5/00
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