| 摘要 |
PURPOSE: A curable liquid polysiloxane/TiO2 composite is provided to manufacture a light-emitting diode with a semiconductor light-emitting diode die and to be used as packing material for light emitting diode. CONSTITUTION: A curable liquid polysiloxane/TiO2 composite comprises polysiloxane prepolymer indicated in chemical formula: (R^4_3SiO_1/2)_a(R^1(R^2)SiO_2/2)_b(R^3SiO_3/2)_c(R^5_xZ_ySiO_(4-x-y)/2)_D, which comprises TiO2 domain with the average domain size is 5 nm or less, contains 20-60 mol% of TiO(total solid phase), and has a reflectivity of 1.67-1.7. A light emitting diode manufacturing assembly comprises a support structure having a plurality of semiconductor electroluminescence diode die, and a mold with many pores corresponding with the light emitting diode die. The many pores are filled with the curable liquid polysiloxane/TiO2 composite.
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