发明名称 Heat-dissipation device and electronic device thereon
摘要 A heat dissipation device is used for a circuit board, and plural electronic components are mounted on a surface of the circuit board. The heat dissipation device includes a heat dissipation plate that is made of metal. Once the heat dissipation plate shields above a surface of the circuit board, a distance exists between the heat dissipation plate and the surface so as to form an air flow passage to increase the heat dissipation performance.
申请公布号 EP2528423(A1) 申请公布日期 2012.11.28
申请号 EP20120155740 申请日期 2012.02.16
申请人 GIGA-BYTE TECHNOLOGY CO., LTD. 发明人 KAO, HAN YU;LIAO, TSE HSINE;KUEI, MIN CHEN
分类号 H05K7/20 主分类号 H05K7/20
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