发明名称 Backlight module with three-dimensional circuit structure
摘要 <p>The present invention relates to a backlight module with three-dimensional circuit structure, comprising: a housing, a thermal conductive material, a three-dimensional circuit module, a plurality of light-emitting devices, a reflective layer, a light guide plate, and a thermal conductive layer, wherein a main body of the three- dimensional circuit module has a plurality of concave holes in the surface thereof, and a three-dimensional circuit layer is disposed on the surface of the main body, the side walls of the plurality of concave holes, and the bottoms of the concave holes; in addition, the light-emitting devices are respectively disposed in the concave holes by way of being welded on the welding points; Therefore, the complete circuit can be disposed in the limit-sized main body, so that, the backlight module with three-dimensional circuit structure can be applied to a thin liquid crystal display device.</p>
申请公布号 EP2527890(A1) 申请公布日期 2012.11.28
申请号 EP20110167489 申请日期 2011.05.25
申请人 KOCAM INTERNATIONAL CO., LTD. 发明人 CHEN, TSAN-JUNG
分类号 G02B6/00 主分类号 G02B6/00
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