发明名称 PROCESS FOR PRODUCTION OF CIRCUIT BOARD
摘要 <p>The present invention provides a highly reliable circuit board that includes TFTs a semiconductor layer of which is formed from an oxide semiconductor; and low-resistance aluminum wirings. The circuit board of the present invention includes an oxide semiconductor layer; source wirings; and drain wirings, wherein each of the source wirings and the drain wirings includes a portion in contact with the semiconductor layer, portions of the source wirings in contact with the semiconductor layer and respective portions of the drain wirings in contact with the semiconductor layer spacedly facing each other, and the source wirings and the drain wirings are formed by stacking a layer formed from a metal other than aluminum and a layer containing aluminum.</p>
申请公布号 EP2528100(A1) 申请公布日期 2012.11.28
申请号 EP20100843931 申请日期 2010.10.25
申请人 SHARP KABUSHIKI KAISHA 发明人 HARA YOSHIHITO;NAKATA YUKINOBU
分类号 H01L29/786;G02F1/1368;G09F9/30;H01L21/02;H01L21/28;H01L21/3205;H01L21/3213;H01L21/336;H01L23/52;H01L27/12;H01L29/45;H01L29/66 主分类号 H01L29/786
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