| 摘要 |
PURPOSE: A sheet for encapsulant is provided to increase mixing ratio of filler and to increase adhesion and heat durability. CONSTITUTION: A sheet for encapsulant is obtained by sintering and processing a mixture, which can be obtained by milling an epoxy resin indicated in chemical formula 1, a curing agent and inorganic filler. In chemical formula 1, R^1-R^4 is a same or different and indicates a methyl group or hydrogen atom, X is -CH2-, -O- or -S-. The curing agent is a phenol resin having biphenylaralkyl skeleton. An electronic component device is obtained by sealing electronic components by sealing electronic components by hardening the seat for encapsulant.
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