| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent warpage by forming thick metal layer at dummy production area except a unit. CONSTITUTION: Plural insulation layers(110, 130) includes a first insulation layer, a second insulation layer and a third insulation layer. Three insulation layers include epoxy-based insulation resin having a low thermal conductivity. The insulation layers include polyimide-based resin having a high thermal conductivity. An internal circuit pattern(120) is formed in the upper or lower part of the first insulation layer.
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