发明名称
摘要 A radiation sensitive resin composition for forming a protective film, comprising: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy group-containing unsaturated compound and (a3) an unsaturated compound different from the components (a1) and (a2) ; [B] a monofunctional polymerizable unsaturated compound having a molecular weight of 180 or more and a carboxyl group; [C] a polyfunctional polymerizable unsaturated compound; and [D] a photopolymerization initiator, a method of forming a protective film from the above composition and a protective film formed from the above composition. The composition can provide a cured film having high flatness, has high developability and heat resistance, is advantageously used to form a protective film for liquid crystal display devices and solid-state image sensing devices, and has high storage stability as a composition.
申请公布号 JP5083540(B2) 申请公布日期 2012.11.28
申请号 JP20070329512 申请日期 2007.12.21
申请人 发明人
分类号 C08G59/34;C08L63/00;G02F1/1333;G03F7/033;G03F7/40 主分类号 C08G59/34
代理机构 代理人
主权项
地址