发明名称 Interconnect Structure Including Hybrid Frame Panel
摘要 An electronic component (10) includes a base insulative layer (12) having a first surface (14) and a second surface (16); at least one electronic device (18) having a first surface (20) and a second surface (22), wherein the electronic device (18) is secured to the base insulative layer (12); at least one I/O contact (24) located on the first surface (20) of the electronic device (18); and a frame panel (26) defining an aperture (42), wherein the electronic device (18) is disposed within the aperture (42), and the frame panel (26) is a multi-functional structure having a first region (28) comprising a first material, wherein a surface of the first region (28) secures to the base insulative layer (12); and a second region (30) comprising a second material, wherein the first material and the second material differ from each other and have differing adhesability to the base insulative layer.
申请公布号 EP2110849(A3) 申请公布日期 2012.11.28
申请号 EP20090157431 申请日期 2009.04.06
申请人 GENERAL ELECTRIC COMPANY 发明人 FILLION, RAYMOND ALBERT;BITTING, DONALD STEPHEN;ABRAHAM, DANIEL LEE
分类号 H01L21/60;H01L23/538 主分类号 H01L21/60
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