发明名称 |
SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD |
摘要 |
<p>Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 µm or below. On the roughened surface, an Ni-Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 µm, a height of 0.6-1.8 µm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 µm. The aforesaid Ni-Zn alloy layer has a Zn content of 6-30 wt% and a Zn deposition amount of 0.08 mg/dm 2 or more.</p> |
申请公布号 |
EP2527498(A1) |
申请公布日期 |
2012.11.28 |
申请号 |
EP20110734780 |
申请日期 |
2011.01.21 |
申请人 |
FURUKAWA ELECTRIC CO., LTD.;NIPPON STEEL CHEMICAL CO., LTD. |
发明人 |
FUJISAWA, SATOSHI;UNO, TAKEO;HATTORI, KOICHI |
分类号 |
C25D7/06;B32B15/01;B32B15/08;C25D5/10;H05K1/09 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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