| 摘要 |
PURPOSE: An epoxy resin composition is provided to increase thermal conductivity by using an epoxy resin comprising a mesogen structure increasing crystallinity, and to provide a radiant circuit board with improved thermal efficiency in case applied to a printed circuit board as an insulative material. CONSTITUTION: An epoxy resin composition comprises epoxy resin, a hardener, and inorganic filler as main components. The epoxy resin comprises an epoxy resin indicated in chemical formula 1. In chemical formula 1, m is an integer from 0-50, and R is hydrogen or alkyl group. The comprised amount of the epoxy resin indicated in chemical formula 1 is 50 wt% or more based on the total weight of the epoxy resin. The amount of the inorganic filler is 40-97 wt% based on the total weight of the epoxy resin. |
