| 摘要 |
PURPOSE: A CMP pad conditioner is provided to increase a lifetime thereof by controlling pressure applied to a cutting tip to change the abrasion speed of the cutting tip. CONSTITUTION: Plural cutting tips are protruded on the surface of a substrate. The plural cutting tips are separated from each other. The upper surface of the cutting tip is a plane which is parallel to the substrate surface. The height of the cutting tip is 100μm or less. The average pressure of one cutting tip is 0.001 lbf/cm2/ ea to 0.2 lbf/cm2/ea. [Reference numerals] (AA) Pad abrasion degree; (BB) Pressure per tip
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