Pre-formed conductive bumps on bonding pads

摘要

Apparatuses including pre-forming conductive bumps on bonding pads for probing and wire-bonding connections and methods for making the same are disclosed. A method may include providing a microelectronic die including a conductive bump formed on a bonding pad, and an insulating layer formed on at least a portion of a surface of the conductive bump, and probing the conductive bump to test the microelectronic die. Other embodiments are also described.