发明名称 SUBSTRATE HEATING DEVICE FOR SEMICONDUCTOR STRUCTURE MANUFACTURING PLANT
摘要 FIELD: chemistry.SUBSTANCE: vacuum assembly for producing semiconductor structures is fitted with means of generating molecular flow of the starting semiconductor material and a substrate heating device, having a substrate holder, a heater connected to a power supply by current leads, and a partition with heat-reflecting properties. The substrate heating device is placed in an additional housing placed inside the working vacuum chamber, where the housing of the additional housing is provided with a removable cover which is mounted in such a way that a working window is formed when it is open in order to form a semiconductor structure, wherein the substrate holder is placed between the removable cover and the heater.EFFECT: high quality of the produced semiconductor structures on large-size substrates owing to uniform heating of the substrate and uniform reduction of the substrate temperature from annealing temperature to the temperature for growing the semiconductor structure, reduced power consumption on heating and annealing substrates.12 cl, 2 dwg, 1 tbl
申请公布号 RU2468468(C2) 申请公布日期 2012.11.27
申请号 RU20100149024 申请日期 2010.11.30
申请人 FEDERAL'NOE GOSUDARSTVENNOE BJUDZHETNOE OBRAZOVATEL'NOE UCHREZHDENIE VYSSHEGO PROFESSIONAL'NOGO OBRAZOVANIJA "NIZHEGORODSKIJ GOSUDARSTVENNYJ UNIVERSITET IM. N.I. LOBACHEVSKOGO" 发明人 SHENGUROV VLADIMIR GENNAD'EVICH;SVETLOV SERGEJ PETROVICH;CHALKOV VADIM JUR'EVICH;DENISOV SERGEJ ALEKSANDROVICH
分类号 H01L21/324 主分类号 H01L21/324
代理机构 代理人
主权项
地址