发明名称 |
Electronic device package and fabrication method thereof |
摘要 |
An electronic device package and a fabrication method thereof are provided. The fabrication method includes providing a semiconductor substrate containing a plurality of chips having a first surface and an opposite second surface. A plurality of conductive electrodes is disposed on the first surface and the conductive electrodes of the two adjacent chips are arranged asymmetrically along side direction of the chip. A plurality of contact holes is formed in each chip, apart from the side of the chip, to expose the conductive electrodes. |
申请公布号 |
US8319347(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US20090470255 |
申请日期 |
2009.05.21 |
申请人 |
TSAI CHIA-LUN;CHIEN WEN-CHENG;LEE PO-HAN;CHEN WEI-MING |
发明人 |
TSAI CHIA-LUN;CHIEN WEN-CHENG;LEE PO-HAN;CHEN WEI-MING |
分类号 |
H01L23/48;H01L21/46;H01L21/4763;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|