发明名称 Method for adapting an electronic component for surface mounting
摘要 The invention relates to a method for adapting an electronic component with leads that are not suited to surface mounting on an electrical circuit. The method includes a step of bending said leads. The bending step shapes the leads of said component so that they are suitable for mounting on the surface of the electrical circuit. In particular, the invention applies to electronic components such as radio frequency and microwave power transistors, marketed notably in a straight-lead version.
申请公布号 US8316538(B2) 申请公布日期 2012.11.27
申请号 US20070518244 申请日期 2007.12.06
申请人 BERTRAM PIERRE;RUFFENACH OLIVIER;PEYRESOUBES GEORGES;THALES 发明人 BERTRAM PIERRE;RUFFENACH OLIVIER;PEYRESOUBES GEORGES
分类号 H01R43/04 主分类号 H01R43/04
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