发明名称 |
Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device |
摘要 |
Provided is a manufacturing method of a semiconductor element substrate including: a step of forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; a step of forming a second photoresist pattern on the second surface of the metallic plate; a step of forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; a step of forming a plurality of concaved parts on the second surface of the metallic plate; a step of forming a resin layer by injecting a resin to the plurality of concaved parts; and a step of etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.
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申请公布号 |
US8319322(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US201113242099 |
申请日期 |
2011.09.23 |
申请人 |
TODA JUNKO;MANIWA SUSUMU;TSUKAMOTO TAKEHITO;TOPPAN PRINTING CO., LTD. |
发明人 |
TODA JUNKO;MANIWA SUSUMU;TSUKAMOTO TAKEHITO |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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