| 摘要 |
A heat dissipation device includes a heat sink, a plurality of fasteners extending through the heat sink, a fan holder mounted on the heat sink and a fan secured on the fan holder. The heat sink includes multiple claws to retain the fasteners therein. The fan holder includes a hoop surrounding the heat sink and a bracket supporting the fan. A plurality of sleeves are formed on the hoop and aligned with the claws of the heat sink, to thereby guide a tool to manipulate the fasteners to secure the heat sink to a printed circuit board. |
