发明名称 MEMS pressure sensor device and method of fabricating same
摘要 A microelectromechanical systems (MEMS) pressure sensor device (20, 62) includes a substrate structure (22, 64) having a cavity (32, 68) formed therein and a substrate structure (24) having a reference element (36) formed therein. A sense element (44) is interposed between the substrate structures (22, 24) and is spaced apart from the reference element (36). The sense element (44) is exposed to an external environment (48) via one of the cavity (68) and a plurality of openings (38) formed in the reference element (36). The sense element (44) is movable relative to the reference element (36) in response to a pressure stimulus (54) from the environment (48). Fabrication methodology (76) entails forming (78) the substrate structure (22, 64) having the cavity (32, 68), fabricating (84) the substrate structure (24) including the sense element (44), coupling (92) the substrate structures, and subsequently forming (96) the reference element (36) in the substrate structure (24).
申请公布号 US8316718(B2) 申请公布日期 2012.11.27
申请号 US20100861435 申请日期 2010.08.23
申请人 LIN YIZHEN;PARK WOO TAE;SCHLARMANN MARK E.;DESAI HEMANT D.;FREESCALE SEMICONDUCTOR, INC. 发明人 LIN YIZHEN;PARK WOO TAE;SCHLARMANN MARK E.;DESAI HEMANT D.
分类号 G01L9/12 主分类号 G01L9/12
代理机构 代理人
主权项
地址