| 摘要 |
PURPOSE: A method for promoting adhesion between a dielectric and metal is provided to improve adhesion by processing the dielectric with solutions including amine compounds greater than curable epoxy compounds. CONSTITUTION: A surface of a dielectric substrate is processed by applying solutions including curable amine compounds and curable epoxy compounds. The solutions are dried near the processed surface of the dielectric substrate. Metal is electroless plated on the processed surface of the dielectric substrate. Amine compounds and epoxy compounds are cured by heating the dielectric substrate plated with the metal. [Reference numerals] (AA) Before; (BB) After
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