发明名称 Stackable electronic component
摘要 An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side.
申请公布号 US8320136(B2) 申请公布日期 2012.11.27
申请号 US20080202985 申请日期 2008.09.02
申请人 XING KUN;INTERSIL AMERICAS INC. 发明人 XING KUN
分类号 H05K7/00 主分类号 H05K7/00
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