发明名称 Cooling high performance computer systems
摘要 A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.
申请公布号 US8320121(B2) 申请公布日期 2012.11.27
申请号 US20100901933 申请日期 2010.10.11
申请人 BISSON SYLVIO;LOTZ WILLI MANFRED;LIQUID COMPUTING CORPORATION 发明人 BISSON SYLVIO;LOTZ WILLI MANFRED
分类号 H05K7/20 主分类号 H05K7/20
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