发明名称 Light emitting diode module having a ground lead
摘要 A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.
申请公布号 US8319429(B2) 申请公布日期 2012.11.27
申请号 US201113008017 申请日期 2011.01.18
申请人 WU WEI-HUNG;LEE HUNG-CHUO;AU OPTRONICS CORPORATION 发明人 WU WEI-HUNG;LEE HUNG-CHUO
分类号 H01J1/62;H01J63/04 主分类号 H01J1/62
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